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Description
Bond-1 SF is a solvent-free, one-coat, self-etching adhesive. Suitable for use with direct composite and dual-cure materials, it provides bond strengths up to 30.4 MPa in 3 steps: uniform application, rubbing for 20 seconds, and light curing.
Bond-1 SF eliminates the need to air dry to protect against sensitivity; prevents evaporation for stability and consistency; eliminates the need to acid etch for shorter procedure time; and exhibits optimal handling properties for a uniform covering.